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SDI06K

特点

● 无铅兼容
● 高Tg无卤,Tg 220℃ (TMA)
● 较低的X/Y/Z轴CTE
● 低介质常数及损耗

应用领域

● 适用于智能手机,笔记本电脑,平板电脑,仪表盘,录像机,电视,电子游戏机,通讯设备及汽车电子等
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Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 260
2.4.24 TMA 220
Td 2.4.24.6 5% wt. loss 420
T288
2.4.24.1 TMA min >60
T260 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 25-30
50-260℃ % 1.4
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50, RC50% - 4.0
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50, RC50%
- 0.0040
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 4.76×108
Surface Resistivity
2.5.17.1
C-96/35/90 1.84×107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 181
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (H Oz)
2.4.8
A N/mm
0.95
Flexural Strength (LW/CW)
2.4.4
A GPa
24/ 23
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.15
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

Remarks:  1. All the typical value is based on the1.0mm specimen. (*) is based on 0.10mm(1x2116) specimen.

2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.

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