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产品与市场

SDI03K

特点

● 无铅兼容

● 高Tg无卤,Tg190℃ (DMA)
● UV阻挡/AOI兼容
● 良好的尺寸稳定性


应用领域

适用于智能手机,笔记本电脑,平板电脑,SSD, DDR, 汽车电子,仪表盘,录像机,电视,电子游戏机,通讯设备等

  • 产品性能
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Items Method Condition Unit Typical Value
Tg 2.4.24.2 DMA 190
2.4.24 TMA 165
Td 2.4.24.6 5% wt. loss 390
T288
2.4.24.1 TMA min >60
T260 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 30
After Tg ppm/℃ 190
50-260℃ % 2.1
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.38
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.0072
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 3.87×109
Surface Resistivity
2.5.17.1
C-96/35/90 1.72×107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 182
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (H Oz)
2.4.8
288℃/10s
N/mm
0.95
Flexural Strength (LW/CW)
2.4.4
A MPa
510/490
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.06
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. Specification sheet: IPC-4101/130, is for your reference only.
2. All the typical values listed above are for your reference only, Please contact Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
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