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产品与市场

SH260

特点

● Polyimide system

● Ultra-high thermal performance

● Tough resin system, Non-MDA chemistry

● Maintain mechanical strength and bonding strength at high temperature

● Halogen-free, chemistry and lead-free compatible

● RoHS/WEEE compliant

应用领域

Burn-in Board

Down Hole

Aircraft andAerospace

Other PCBrequirements to work under high temperature for long time


  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.24 TMA >250
Td 2.4.24.6 5% wt. loss 429
T300 2.4.24.1
TMA min
>60
CTE (Z-axis) 2.4.24 50-260℃ (X/Y) ppm/℃ 12-15
α1 (before Tg) ppm/℃ 45
50-260℃ % 1.20
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 4.12
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.007
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 7.45 x 107
Surface Resistivity
2.5.17.1
C-96/35/90 4.79 x 107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 180
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 40.5
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm[lb/in] 1.37[7.83]
Flexural Strength 2.4.4 50℃/260 MPa

530/439

Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.26
Flammability
UL94
C-48/23/50
Rating
HB

Remarks:

Specification sheet IPC-4101/40, /41, is for your reference only.
1. All the typical value is based on the 1.6mmspecimen, but 1) specimen thickness 0.1mm.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information,
and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.


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